HOME ABOUT US PRODUCTS LITERATURE PACKAGING NEWS CONTACT US STORE
 
  CORPORATE LINKS SEARCH:    
 










General Purpose Applications
General Purpose Applications

As a leading source for specialized adhesives, TRA-CON has over a thousand existing formulations and the ability to custom formulate adhesive products for any application. TRA-CON offers UL Approved flame retardant products for the aerospace and electronics industries. We have formulated adhesives specifically for bonding to diverse plastic substrates. TRA-CON carries lightweight adhesives and sealants for applications sensitive to weight such as hand held devices. TRA-CON has provided innovative adhesive solutions for more than 30 years. Let us put that experience and those materials to work for you. Industries as diverse as telecommunications, electronics, and aerospace as well as basic manufacturing rely on TRA-CON to provide the best adhesive to satisfy their requirements.

View the Application Guides for General Purpose SystemsCasting SystemsUV Curable Systems



Photonics Applications
Photonics Applications

TRA-CON offers the industry's widest selection of fiber optic, electro-optic and laser adhesives, as well as casting polymers. We have developed a range of materials to effectively terminate and connect assorted fiber optic cable assemblies. We have formulations which are widely used in OEM environements as well as materials designed for use in field applications. TRA-CON is a leading manufacturer of adhesives and coatings used in flat panel displays more specifically touch screens. these same low viscosity high optical transmittance adhesives are used extensively in component protection applications inculding insulation sealing, EGP and ESD applications.

View the Application Guides for Photonics



Electronics Applications
Electronics Applications

Known for developing high reliability special formulations for demanding applications, TRA-CON has a proven line of thermally and electrically conductive epoxies and silicones. TRA-CON products are designed to provide reliable component protection in applications such as heat sink bonding, solderless connections, die attach and surface mount. They are designed to meet the challenges of heat dissipation that result from increasing line densities and shrinking geometries such as wireless communications, satellite transmission and circuit board manufacturing. TRA-CON’s adhesive systems include room temperature curing formulations, snap cures, and formulations with low inonics for high purity applications. TRA-CON specializes in the inclusion of various fillers in order to achieve your adhesive specifications. For example TRA-CON currently manufactures a patented diamond filled system for the most demanding thermal management applications.

View the Application Guide for Electronics



Medical Applications
Electronics Applications

TRA-CON provides proven adhesive systems for biomedical applications ranging from sophisticated medical imaging and monitoring devices to catheters, guide wires, probes and other disposable medical devices. Some of these materials have been certified as USP Class VI thermosets after cure, making these adhesives ideal for your medical device assembly. TRA-CON’s adhesives are designed to withstand most sterilization processes including; EtO, steam, and Sterrad systems. TRA-CON carries biomedical electrically conductive room temperature curing adhesives for component attachment in medical electronic applications. We have also incorporated our experience in the fiberptic market to design superior glass bonding adhesives which pass biocompatibility testing for use in medical fiber optic applications. TRA-CON also provides specialty packaging for use in clean room environments to maintain the integrity of our customers manufacturing processes.

View the Application Guide for Biomedical



Paste Applications
Paste Applications

As a leading source for specialized and reliable adhesives, TRA-CON has a proven line of pre-mixed, frozen adhesives. These TRA-CON adhesives are used in microelectronic applications including heat sink attach, die attach, component staking and package sealing. Several of these adhesive systems are designed for encapsulating microelectronic chips to provide excellent environmental and mechanical protection. TRA-CON carries adhesives to be used in applications ranging from surface mount device attachment to guidance instrument applications. The paste adhesive systems include room temperature curing formulations, snap cures, polyurethanes and polysulfides. These materials are formulated to bond to various substrates such as plastics, glass and metals including gold, sivler, nickel, copper and brass. Several of these pre-mixed, frozen adhesives have the option to be packaged in BIPAX kits for room temperature storage.

View the Application Guide for Pre-Mixed and Frozen Systems



Thermal Interface Materials
Thermal Interface Materials

TRA-CON, the leader in adhesive technology for over sixty years, has a new line of thermal interface materials, including pads & films, phase change materials, greases and conductive adhesives.

View the Application Guide for Thermal Interface Materials

Samples and Technical Support are available upon request.



 
Store  Products  Packaging  News   Product Selector  Literature  FAQ's   Site Map  About Us  Contact  Home

NORTH AMERICA
46 Manning Road, Billerica, MA 01821
Phone 978-436-9700
Fax 978-436-9701
EMAIL CONTACTS:
Customer.ServiceNA@nstarch.com
Technical.ServiceNA@nstarch.com

The TRA-CON logo is a trademark of
National Starch and Chemical.
All contents copyright © 2008
All rights reserved.
View Disclaimer | View Privacy Policy |